Press Release
☷CHIPS for America Releases Vision for Approximately $3 Billion National Advanced Packaging Manufacturing Program
National Institute of Standards and Technology ( By Press Release office)
Nov 22,2023
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Today , the Biden - Harris administration announced their plan to enhance U . S . capabilities in advanced packaging , which is a crucial technology for manufacturing top - of - the - line semiconductors . During a speech at Morgan State University , Laurie E . Locascio , the Under Secretary of Commerce for Standards and Technology and Director of the National Institute of Standards and Technology ( NIST ) , explained how the U . S . will benefit from the Department of Commerce ' s CHIPS for America program , which offers manufacturing incentives and supports research and development . The National Advanced Packaging Manufacturing Program will receive approximately $3 billion in funding to establish U . S . leadership in advanced packaging . The first funding opportunity for this program is expected to be announced in early 2024 . Supporting innovation and maintaining America ' s position in cutting - edge research is a crucial part of the president ' s Investing in America agenda . Commerce Secretary Gina Raimondo emphasized the importance of investing in domestic packaging capabilities and research and development to foster a thriving semiconductor industry in the U . S . The goal is to create an environment where new chip architectures can be developed in research labs , designed for various applications , manufactured at scale , and packaged using advanced technologies . This vision for advanced packaging aligns with President Biden ' s agenda and aims to make the U . S . a leader in state - of - the - art semiconductor manufacturing . NIST Director Laurie E . Locascio envisions that within ten years , America will both manufacture and package the world ' s most advanced chips . This means establishing a high - volume advanced packaging industry that is self - sustaining , profitable , and environmentally friendly , while also accelerating research to introduce new packaging approaches to the market . The CHIPS for America program has published "The Vision for the National Advanced Packaging Manufacturing Program" ( NAPMP ) , which outlines the goals , mission , and objectives of the advanced packaging program created by the bipartisan CHIPS and Science Act . The NAPMP is one of four CHIPS for America R&D programs that are collectively building the necessary innovation ecosystem to ensure that American semiconductor fabrication facilities , including those funded by the CHIPS Act , produce the most sophisticated and advanced technologies . Advanced packaging is an innovative design and manufacturing method that involves placing multiple chips with various functions in a compact and interconnected package . This design approach helps the industry achieve the increasingly dense and smaller dimensions required for the most advanced semiconductors . Hey , so basically , advanced packaging is a big deal and involves a bunch of different experts working together . Right now , the US is kinda lacking in this area , so we ' re trying to step up our game . The CHIPS for America R&D program is gonna help us develop better packaging technology here in the US . We ' re gonna invest about $3 billion in things like testing facilities , training programs , and funding for different projects . This program is part of a bigger plan to boost our country ' s tech and economic leadership . If you ' re interested , there ' s gonna be a briefing about the program on Nov . 27 , 2023 . Just gotta register beforehand . CHIPS for America is all about investing in America , creating jobs , and boosting our manufacturing capabilities . Both offices are located at the National Institute of Standards and Technology ( NIST ) within the Department of Commerce . NIST is all about promoting innovation and competitiveness in the US by advancing measurement science , standards , and technology . They ' re in a great position to run the CHIPS for America program because they have strong relationships with US industries , a deep understanding of the semiconductor ecosystem , and a reputation for being fair and trusted . If you want to learn more , check out chips . gov . If you need to get in touch with the media , contact Madeline Broas at madeline . broas@chips . gov or ( 301 ) 520 - 7407 . And if you want updates from NIST , sign up with your email address . This information was released on November 20 , 2023 , and updated on February 1 , 2024 .
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